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A STUDY OF SOME MECHANICAL PROPERTIES OF COPPER-CERAMIC INTERFACE | ||
| Journal of University of Anbar for Pure Science | ||
| Article 15, Volume 5, Issue 2, 2011, Pages 64-68 PDF (186.93 K) | ||
| DOI: 10.37652/juaps.2011.15376 | ||
| Author | ||
| Hatam Abdul-Razzak Taha | ||
| Abstract | ||
| Element Cu have been deposited on ceramic substrate by use of physical vapor deposition with plasma aided (Ion plating technology ) . The effect of deposition process parameter on mechanical properties of copper thin films were studied ( adhesion and microhardness ) . Also effect of surface nature and temperature annealing have been studied which obtained increase in adhesion and microhardness with increase in applied voltage and annealing . SEM study show that the smooth surface have good uniformity and interface type between the film and substrate . | ||
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