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Rheological Behavior of Isothermal Cured Epoxy/1,4-Diaminobenzene Systems | ||
| DIYALA JOURNAL OF ENGINEERING SCIENCES | ||
| Article 7, Volume 11, Issue 1, 2018, Pages 38-43 PDF (0 K) | ||
| Authors | ||
| Muataz H. Ismael; Salah N. Farhan; Ayad Dari Jaafar | ||
| Abstract | ||
| A novel curing agent (1,4-diaminobenzene) was used to enhance behavior of the epoxy resin system. The effect of the curing agent content (12 to 21 wt%) subjected to the isothermal curing temperatures at 80 °C to 110 °C were performed. Results indicate that the gel time was effected slightly on the viscosity when the curing temperature was higher than 90 °C and curing material consist over from 18wt %. These results explain that reaction rates caused by higher curing temperature. | ||
| Keywords | ||
| Rheological; Curing agent system; Epoxy system; Curing temperature | ||
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