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Fabrication and Characterization of Highly Pure and Fine Copper Powder by Electrodeposition | ||
| Engineering and Technology Journal | ||
| Volume 24, Issue 4, April 2005, Pages 384-402 PDF (2.82 M) | ||
| Document Type: Research Paper | ||
| DOI: 10.30684/etj.24.4.4 | ||
| Authors | ||
| Haidar A. Hussein1; Waleed A. Hanna2; Jehad Abid3; Qusay A. Hanna4 | ||
| 1College of Electronics & Electrics Technicals | ||
| 2Dep, of Material Eng., University of Technology | ||
| 3Ministry of Science & Technology | ||
| 4Dep. of Electrical & Electronic, University of Technology | ||
| Abstract | ||
| ABSTRACT Electrodeposition is a candidate method for producing fine and pure copper powder , which have a wide range of uses in different fields such as in applications of aerospace , atomic energy , defense , electronics , paints , plastics , cutting tools , ... etc . This work focusing on studying some working variables such as voltage , temperature , copper sulfate concentration , sulfuric acid concentration , circulation velocity and lanoline addition on fineness and producebility of deposited copper powder . Optimum conditions concluded for copper powder fineness were at ( 1.6V , 30 ° C , 25g / L of copper sulfate , 150g / L of sulfuric acid and circulation velocity of 150 rpm . Addition of 0.075g of lanoline increase the fineness of deposited copper powder , but did not affect clearly the dendritic shape of deposited particles . | ||
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