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MICROSTRUCTURAL STUDY OF STEEL TO COPPER BRAZED AND SOLDERED JOINTS | ||
| AL-TAQANI | ||
| Article 1, Volume 25, Issue 1, 2012, Pages 0-0 | ||
| Abstract | ||
| The purpose of this work is to study the microstructure of the bonding zone between the low carbon steel (ASTM A36) and the pure copper (OFHC) by two welding process, brazing and soldering. In brazing process, two types of filler metal alloy were used, namely (DIN SCuZn40Si) and (AWS LCuP-7), while in soldering process only eutectic soldering filler of (Sn-Pb) was used. Oxyacetylene gas welding technique has been used in welding of Lap-joint type. Microscopic examinations showed that there is a clear bonding phase and interface in brazed joints , while welding by soldering have no such features. It was also apparent that the high chemical effinity between the filler metal alloy and the base metal will reduce the existence of defects in the bonding zone. Key words: Microstructure , Brazing , Soldering , Copper , Steel | ||
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