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STUDY OF FINS SHAPES' EFFECT ON NATURAL THERMAL CONVECTION | ||
| Al-Qadisiyah Journal for Engineering Sciences | ||
| Article 5, Volume 2, Issue 2, 2009, Pages 55-62 PDF (0 K) | ||
| Author | ||
| Waleed Mohammad Abid | ||
| Abstract | ||
| In many electric circuit boards thermally induced buoyancy effects are not always sufficient to adequately cool high density electronic packages found in modern circuit boards. Instances thermal enhancement techniques, such as heat sinks, must be used to increase the effective surface area for heat transfer so lower the thermal resistance between sources and sink. Both vertical rectangular and pin finned surfaces were studied to show the shape effect and natural convection heat transfer coefficient. The thermal dissipated from vertical rectangular finned surfaces greater than pins finned surfaces. The overall thermal resistance of the pins finned surfaces greater (31%) compared with vertical rectangular finned surfaces. An empirical equation was predicted to calculate average natural convection heat transfer coefficient from vertical rectangular and pin fins. The results show an excellent convince with the Literature review where the overall error was about (0.12%). | ||
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