Hamadi, O. (2008). The Fundamentals of Plasma-Assisted CVD Technique Employed in Thin Films Production. , 1(2), 3-8.
O.A. Hamadi. "The Fundamentals of Plasma-Assisted CVD Technique Employed in Thin Films Production". , 1, 2, 2008, 3-8.
Hamadi, O. (2008). 'The Fundamentals of Plasma-Assisted CVD Technique Employed in Thin Films Production', , 1(2), pp. 3-8.
Hamadi, O. The Fundamentals of Plasma-Assisted CVD Technique Employed in Thin Films Production. , 2008; 1(2): 3-8.

The Fundamentals of Plasma-Assisted CVD Technique Employed in Thin Films Production

Iraqi Journal of Applied Physics Letters
Article 1, Volume 1, Issue 2, 2008, Pages 3-8
Author
O.A. Hamadi
Abstract
This paper reviews the physical and chemical principles of plasma-assisted chemical vapor deposition (CVD) technique for thin films. We focus on the integration, process, and reliability requirements for dielectric films used for isolation, passivation, barrier, and antireflective-coating applications in ultra-large-scale integrated (ULSI) semiconductor circuits.
Keywords
PECVD; Dielectric films; ULSI circuits; Microelectronics production
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