Heat Transfer in Electronic Systems Printed Circuit Board: A Review

Kadum, Mustafa E.; Imran, Ahmed A.; Aljabair, Sattar

doi:10.30684/etj.v40i1.2113

	Heat Transfer in Electronic Systems Printed Circuit Board: A Review
Engineering and Technology Journal
Article 12, Volume 40, Issue 1, 2022, Pages 99-108 PDF (711.78 K)
DOI: 10.30684/etj.v40i1.2113
Authors
Mustafa E. Kadum^* ; Ahmed A. Imran; Sattar Aljabair
University of Technology-Iraq, Alsina’a street, 10066 Baghdad, Iraq.
Abstract
Thermal regulation has now become a staple in the design of electronic devices. As a result of technological advances in the electronic industry, component miniaturization and thermal system management are becoming more and more important. Due to the high demand for device performance and the need for better thermal management, this paper present a detailed theoretical review of heat transfer by conventional methods in electronic devices and equipment such as air cooling, water cooling, etc. to provide an ideal framework for a practical application in electronic cooling. With reference to the possibility of investing unconventional ways to reduce the energy consumed in the cooling process and preserving the environment through the possibility of replacing solid circuit boards with flexible circuits and studying their properties in improving heat transfer and deformation of P.C.B using the interaction of fluid structure under thermal and flow effects.
Highlights
Provide a detailed review of heat transfer methods in electronic devices. New environmentally friendly technologies are reviewed to improve heat transfer. Discussing the possibility of replacing RPCB with FPCB in electronic circuits. FPCB investment discussion to improve PCB thermal design.
Keywords
Electronic system cooling; Flexible printed circuit board; Thermal management system; Heat transfer enhancement in Electronic device

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